News Article
Tools Move In To 300mm Singapore Fab
The Singapore-based 300mm joint venture, UMCi, has begun equipment move-in. The venture brings together UMC, Infineon Technologies and EDB Investments, the Singapore governments Economic Development Boards investment arm.
The Singapore-based 300mm joint venture, UMCi, has begun equipment move-in. The venture brings together UMC, Infineon Technologies and EDB Investments, the Singapore governments Economic Development Boards investment arm.
Among the first tools to arrive was copper processing equipment from Applied Materials and Tokyo Electron (TEL).
Total planned capacity for the facility is 40,000 wafers per month and overall investment is expected to be $3.6bn. Current installation will primarily focus on copper backend processing equipment, with front-end equipment expected to follow later this year.
UMCs first 300mm fab in Taiwan is currently in volume production for customer products.