News Article
Corning Has Received A Patent For A Photoblank Substrate Material Specific
Corning has received a patent for a photoblank substrate material specific
to the 248nm and 193nm microlithography technology nodes.
Corning has received a patent for a photoblank substrate material specific
to the 248nm and 193nm microlithography technology nodes. The material has a
transmission factor greater than 90% on a 6.35mm thick photoblank substrate
at 193nm. Uniformity across the photoblank shows a variation no greater than
1%.
to the 248nm and 193nm microlithography technology nodes. The material has a
transmission factor greater than 90% on a 6.35mm thick photoblank substrate
at 193nm. Uniformity across the photoblank shows a variation no greater than
1%.