News Article
Frankfurt-based Covion Organic Semiconductors Has Signed A Memorandum Of
Frankfurt-based Covion Organic Semiconductors has signed a memorandum of
understanding (MOU) for co-operation in organic semiconductor materials with
Taiwan's Industrial Technology Research Institute (ITRI). The agreement
covers future R&D project development and co-operation in chemical
engineering, innovative materials and opto-electronic devices with ITRI
divisions and centres in Taiwan. Covion says it is the only company offering
both small molecule and polymer light emitting materials on a commercial
scale for flat panel display and opto-electronic applications.
NEXX Systems, a supplier of PVD systems to the advanced packaging industry,
has joined the Semiconductor Equipment Consortium for Advanced Packaging
(SECAP). NEXX adds under bump metallurgy (UBM) and backside metallisation to
the consortium's equipment portfolio. The new addition closes a technology
gap that was opened in November 2001 when the consortium accepted the
resignation of Unaxis Semiconductors from SECAP. The SECAP process equipment
portfolio now includes wafer plasma cleaning, UBM deposition, resist
coating, precision photomasks, exposure and development, UBM spray etching,
electroplating, resist stripping and bump inspection.
CSR (Cambridge Silicon Radio) and Fujitsu have agreed to work together on
supplying Flash memory for Bluetooth requirements. Products are already
available. Fujitsu has created 3.0V, 4Mbit and 8Mbit, Flash memory optimised
for CSR as part of the agreement. The devices are available in FBGA, CSP and
TSOP packaging. Fujitsu will also create 1.8V 4Mbit and 8Mbit Flash. The
devices will be sold through CSR channels bundled with CSR BlueCore
solutions. Memory parts will also be sold by Fujitsu. Fixed pricing on the
Flash memory is being offered for the next 12 months, with a guaranteed
supply from Fujitsu.
Dialog Semiconductor has signed an agreement with car component producer
Bosch to develop and qualify high voltage options for CMOS technology. The
first focus of the collaboration is joint qualification for single chip ICs
to control small electrical motors, to be used by one of Bosch's business
units. The aim is to integrate high performance analogue circuits, embedded
flash memory, microcontroller, high density digital logic and high voltage
(40V) circuits on a single chip.
has joined the Semiconductor Equipment Consortium for Advanced Packaging
(SECAP). NEXX adds under bump metallurgy (UBM) and backside metallisation to
the consortium's equipment portfolio. The new addition closes a technology
gap that was opened in November 2001 when the consortium accepted the
resignation of Unaxis Semiconductors from SECAP. The SECAP process equipment
portfolio now includes wafer plasma cleaning, UBM deposition, resist
coating, precision photomasks, exposure and development, UBM spray etching,
electroplating, resist stripping and bump inspection.
CSR (Cambridge Silicon Radio) and Fujitsu have agreed to work together on
supplying Flash memory for Bluetooth requirements. Products are already
available. Fujitsu has created 3.0V, 4Mbit and 8Mbit, Flash memory optimised
for CSR as part of the agreement. The devices are available in FBGA, CSP and
TSOP packaging. Fujitsu will also create 1.8V 4Mbit and 8Mbit Flash. The
devices will be sold through CSR channels bundled with CSR BlueCore
solutions. Memory parts will also be sold by Fujitsu. Fixed pricing on the
Flash memory is being offered for the next 12 months, with a guaranteed
supply from Fujitsu.
Dialog Semiconductor has signed an agreement with car component producer
Bosch to develop and qualify high voltage options for CMOS technology. The
first focus of the collaboration is joint qualification for single chip ICs
to control small electrical motors, to be used by one of Bosch's business
units. The aim is to integrate high performance analogue circuits, embedded
flash memory, microcontroller, high density digital logic and high voltage
(40V) circuits on a single chip.
